Case studies
Boards we've shipped.
5G mmWave front-ends, smartphone mainboards, automotive ECUs, industrial IoT — a sample of what comes out of the same calculator you're about to use.
IndustrialIndustrial IoT Sensor Cluster
Aluminum-core 2-layer for a vibration sensor cluster running in -40°C to +85°C environments. Conformal coat ready, IPx7 housing.
finish: HASL_LEAD_FREElayers: 2material: Aluminum-coreconformal: true
AutomotiveAutomotive ECU (AEC-Q100)
Four-layer high-Tg FR-4 with 3oz copper for an EV battery management ECU. AEC-Q100 grade-1, IPC Class 3, ENIG. AEC-qualified factory partner.
finish: ENIGlayers: 4copperOz: 3ipcClass: 3
ConsumerFlagship Smartphone Mainboard
Ten-layer HDI with stacked microvias and via-in-pad for a 0.4 mm pitch SoC. ENIG finish, immersion silver on RF zones. 50,000 unit production run.
finish: ENIGlayers: 10material: FR4 HDIviaInPad: true
Telecom5G mmWave Front-End Module
Six-layer Rogers stack-up for a 28 GHz beamforming front-end. ±5% impedance control, GCPW routing, ENIG finish. Shipped 8,000 units to a Tier-1 OEM.
finish: ENIGlayers: 6freqGHz: 28material: Rogers RO4350B